• Introduction
• In-line integration
• Small molecule deposition
• Inkjet Printing
• Cathode deposition
• Thin Film Encapsulation
• Linear Motor System

Thin Film Encapsulation

Instead of using an inflexible and costly glass coverlid with a getter, OTB Display uses thin film encapsulation to protect OLED devices from moisture and air penetration.

Thin film encapsulation significantly reduce material costs for OLED devices and is a key enabler for large area and flexible display and lighting applications.

OTB Display's encapsulation stack is build-up using a sequence of organic and inorganic layers.

The inorganic layers are grown using PECVD. The amorphous hydrogenated silicon nitride (a-SiNx:H) is deposited by a ICP source which allows for dense layers deposited at high rates (up to 5 nm/s) and at low temperatures (< 120°C). 

The organic layers are used to increase the diffusion path of water when penetrating the OLED device and are deposited by inkjet printing combined with UV curing.

Deposition by means of printing results in decreased material costs. The fluid is only deposited at the needed area. The system consists of an industrially proven printhead, which is fed by a separate fluid system and its own driving hardware.

The same printing system is used for an anti-scratch top layer that mechanically protects the device from possible damage.